The 17th IEEE International Conference on Green Computing and Communications
Melbourne, Australia
| 06-08 December 2021
Albert Zomaya, University of Sydney, Australia
Geyong Min, University of Exeter, UK
Wei Zhang, University of New South Wales, Australia
Dusit Niyato, Nanyang Technological University, Singapore
Yan Zhang, University of Oslo, Norway
Sheng Wen, Swinburne University of Technology, Australia
Leo Zhang, Deakin University, Australia
Jiangshan Yu, Monash University, Australia
Jianhua Ma, Hosei University, Japan
Laurence T. Yang, St. Francis Xavier University, Canada
Dr. Michele Albano, Aalborg University, Denmark
Dr. Ranbir Batth, Lovely Professional University, India
Dr. Benjamin Belzer, Washington State University, United States
Dr. Roberto Bruschi, CNIT, Italy
Dr. JinHyeock Choi, Samsung AIT, South Korean
Prof. Cheng-Fu Chou, NTU, UK
Dr. Ken Christensen, University of South Florida, United States
Prof. Yeh-Ching Chung, Chinese University of Hong Kong in Shenzhen, China
Dr. Antonio de la Oliva, Universidad Carlos III de Madrid, Spain
Dr. Luis Diez, University of Cantabria, Spain
Prof. Zheng Dong, Shandong University, China
Prof. Chao Fang, Beijing University of Technology, China
Mr. Alireza Ghasempour, ICT Faculty, Iran
Dr. Javier Gozalvez, Universidad Miguel Hernandez de Elche, Spain
Dr. Fei Hao, Shaanxi Normal University, China
Prof. Chun-Hsi Huang, Southern Illinois University Carbondale, United States
Dr. Filip Idzikowski, Poznan University of Technology, Poland
Prof. Marco Listanti, University of Rome "La Sapienza", Roma
Mr. Hongbo Liu, University of Electronic Science and Technology of China, China
Prof. Pietro Manzoni, Universitat Politècnica de València, Spain
Prof. Yinbin Miao, Xidian University, China
Dr. Francesco Musumeci, Politecnico di Milano, Italy
Prof. Tadashi Nakano, Osaka University, Japan
Prof. Roberto Rojas-Cessa, New Jersey Institute of Technology, United States
Dr. Jose Santa, Technical University of Cartagena, Spain
Dr. Miguel Sepulcre, Universidad Miguel Hernandez de Elche, Spain
Prof. Bo Sheng, University of Massachusetts Boston, United States
Dr. Massimo Tornatore, Politecnico di Milano, Italy
Mr. Song Wei, North China University of Technology, China
Prof. Dapeng Wu, CQUPT, China
Dr. Tianhua Xu, Tianjin University, China
Prof. Changyan Yi, Nanjing University of Aeronautics and Astronautics, China
Dr. Chau Yuen, Singapore University of Technology and Design, Singapore
Dr. Sherali Zeadally, University of Kentucky, UK